Shenmao SMF-D61 low-residue no-clean flip chip flux leaves behind minimal residue after reflow, ensuring clean and reliable solder joints.

Is halogen-free and complies with RoHS, RoHS 2.0, and REACH standards. Is free from intentionally added halogens. Is designed for flip-chip dipping applications. Offers wetting characteristics and solderability, facilitating precise and robust solder joints. Is fully compatible with underfills and EMC, eliminating need for cleaning flux residue before proceeding with subsequent processes.

Achieves flux residue levels as low as 5% after reflow, for performance and reliability.

Shenmao Technology

www.shenmao.com