The TR7600F3D SII Plus 3-D CT AXI integrates a next-generation 110kv x-ray source and 3-25µm high-resolution detectors and AI-powered inspection algorithms.

Is capable of inspection across various components, including BGA, QFN, SiP, PTH, PoP, wire and die bond, and is designed for the inspection of high-reliability electronics manufacturing industries such as Advanced Packaging, Automotive, Aerospace and Medical. Features EtherCAT for enhanced connectivity and Smart Board Warpage Control, plus integrates with Smart Factory production lines and the MES of user's choice. Supports current Smart Factory Standards, including the IPC-CFX, IPC-DPMX, and The Hermes Standard (IPC-HERMES-9852).

TRI

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