Delo's Dualbond EG6290 sealant adhesive is designed for CMOS image sensors.

Can be dispensed in narrow, high bondlines, can compensate for temperature-dependent pressure changes, and meets routine automotive standards. Compared to previous products, has a significantly higher Young's modulus of 2,350MPa and significantly higher adhesion value. Also features a glass transition temperature of over +130 °C and exhibits mechanically consistent behavior even at high application temperatures and can compensate for temperature-dependent pressure changes. Fulfills the requirements of the AEC-Q100 Grade 2 automotive industry standard.

Delo Industrial Adhesives

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