Heraeus Electronics' mAgic PE360 silver sinter paste is said to offer enhanced thermal performance compared to traditional soldering methods.

Is lead-free and halogen-free, features workability and drying behavior that minimize voiding in the paste layer, and is able to sinter at very low pressure and temperature levels. Is said to be ideal for sintering finished molded modules, and simplifies the manufacturing process compared to conventional sinter pastes for die attach. Also features a typical thermal conductivity of ≥200W/mK and excellent reliability for large area sinter connections, and supports both dry or wet placement and pressure sintering at temperatures of ≥200°C.

Heraeus Electronics

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