ASMPT's Siplace CA2 hybrid placement machine combines semiconductor and SMT production to integrate the production of SiPs (system-in-package modules) directly into the SMT line.

Processes both SMDs from tapes and dies taken directly from the wafer in a single step at speeds of up to 50,000 dies or 76,000 SMT components per hour with a precision of up to 10μm at 3σ. Features a buffer storage module that works similar to a placement head and can hold 16 new dies (plus four on the flip unit) while the placement head itself is still placing SMDs. Also features full single-die-level traceability, which automatically logs for each die its pick-up position as well as its placement position on the board, as well as speedy program and product changeovers, placement program portability to any machine of the same type, and fast and comprehensive substrate mapping.

ASMPT

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