Indium's Durafuse HR solder paste alloy is said to deliver enhanced thermal cycling performance and superior voiding performance without vacuum reflow, especially for high-reliability automotive applications.

Is engineered to withstand 3,000+ thermal cycles at -40°C/125°C across different PCB finishes and component types, and reportedly outperforms SAC305 with bottom-terminated component voiding. Also offers reduced solder joint cracking and increased shear strength. Is compatible with most SAC305 reflow profiles and standard PCB surface finishes, including ImSn, OSP, and ENIG.

Indium Corp.

indium.com