Indium's high-reliability gold-based PDA preforms offer a high level of precision to reduce defects, control bondline thickness, and deliver high-yield performance and reliability in critical die-attach applications.

Features include highly accurate thickness control, precise edge quality, optimized cleanliness, and default waffle pack method. Are available in the following alloys: primary- 80Au/20Sn, 79Au/21Sn; development- 78Au/22Sn, 77Au/23Sn, 76Au/24Sn, 75Au/25Sn, 88Au/12Ge, 96.8Au/3.2Si, 82Au/18In.

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