Rohm Semiconductor's surface-mount SiC Schottky barrier diodes (SBDs) improve insulation resistance by increasing the creepage distance between terminals.

Use an original design that removes the center pin previously located at the bottom of the package, extending the creepage distance to a minimum of 5.1mm, about 1.3 times greater than standard products. Minimizes the possibility of tracking (creepage discharge) between terminals and eliminates the need for insulation treatment through resin potting when surface mounting the device on circuit boards in high-voltage applications. Can also be mounted on the same land pattern as standard and conventional TO-263 package products, allowing easy replacement on existing circuit boards. Offered in two voltage ratings – 650V and 1200V – supporting 400V systems commonly used in xEVs, as well as higher-voltage systems expected to gain wider adoption in the future.

Rohm Semiconductor

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