Ersa's HR 600P tabletop rework system offers automatic residual solder removal and reproducible soldering results.

Features infrared heating elements in the bottom-side emitter to heat the assembly homogeneously, while a dynamic hybrid heating head ensures targeted and efficient component heating from above by combining infrared radiation and convection heating. Is able to use high-precision thermocouples or the non-contact, digital Virtual Thermocouple (VTC) for closed-loop temperature control, and can automatically calculate the exact component position and place it with a vacuum gripper via its precise axis system. Also features a high-performance reflow process camera with LED illumination for process monitoring and documentation, with all operations monitored and documented by the HRSoft 2 operating software, which also allows for connection to customer MES systems. Available in version with large PCB holder capable of processing assemblies of up to 642mm x 423mm, with another version offering a lowered heating cassette to create additional free space on the underside of the assembly for tall structures. Both versions can be combined. Can be used with Ersa Dip&Print Station, which reliably applies a defined amount of flux or solder paste to the components, as well as the Auto Scavenger SC 600 scavenging module, which can extract remaining solder from the pads in an automated process without touching the PCB surface.

Kurtz Ersa

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