Shenmao's PF925-P250 no-clean lead-free solder paste was developed to address the need for high- reliability solder solutions in demanding applications.

Includes indium and bismuth in the solder matrix to form a solid solution in the Sn matrix and significantly increase strength and reliability compared to traditional SAC solders. Also features a lower melting point compared to SAC solders. Is halogen-free (ROL0), and is fully compliant with RoHS, RoHS 2.0 and REACH regulations to meet stringent environmental and safety standards. Is said to offer superior low- voiding performance, particularly with challenging components such as BGAs, QFNs and MOS devices that require large ground pad contact.

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