TRI Launches TR7600FB SII 3-D AXI
TRI's TR7600FB SII 3-D AXI system is designed to address diverse product layouts and is optimized for specialized substrates, BGAs, multilayered structures, SiP, IC, CSP, flip-chip and more.
Can inspect large boards up to 850mm x 520mm and up to 12kg in weight, with a resolution ranging from 5–30µm. Design allows tube to get exceptionally close to the bottom side without structural interference, ensuring precise imaging even when components are on the top and the bottom is clear of obstacles. Prioritizes usability and integrates AI into key inspection processes, and intuitive interface and AI-assisted programming allow operators to quickly and efficiently set up and manage inspection programs. Supports inline fine-tuning for multiple samples without interrupting production and integrates with Smart Factory production lines and MES to ensure compatibility and future-proofing of production processes. Supports current Smart Factory standards, including the IPC-CFX, IPC-DPMX and The Hermes Standard (IPC-HERMES-9852).
Test Research Inc.
