Master Bond EP53TC two-component epoxy is for bonding, sealing, coating and small potting applications.

Is formulated with a specialty filler with a particle size ranging from 5 to 30 microns. It is a flowable system with a mixed viscosity of 45,000-65,000 cps at room temperature. Filler size and its relatively flowable viscosity enable the filling of small voids, for heat dissipation.

Meets ASTM E595 NASA low outgassing specifications and provides reliable electrical insulation with a volume resistivity greater than 10¹⁴ ohm^-cm. Thermal resistance is 10^-15 x 10^-6 K•m2/W and thermal conductivity is 2.3-2.6 W/(m•K). Exhibits dimensional stability with low shrinkage upon curing and a low coefficient of thermal expansion of 14^-16 x 10-6 in/in/°C. Mechanical properties include a tensile strength of 5,000 to 7,000 psi, a tensile modulus greater than 1,000,000 psi, and a Shore D hardness of 85-95. Service temperature range is from -100º to +300ºF (-73º to +149ºC). A moderate heat cure is required to achieve optimal properties. Rrecommended cure schedule is 2 hr. at 80ºC followed by a post-cure of 90-120 min. at 125ºC. Comes in various packaging options, including ounce kits, quarter pint kits, half pint kits, pint kits and quart kits.

Master Bond

https://www.masterbond.com/tds/ep53tc