Shenmao Technology's SMF-WC58 is a halogen-free, water-soluble tacky flux. Engineered for ultra-fine bump pitch flip-chip and BGA/CSP processes. Designed for advanced semiconductor packaging. Delivers wettability on a broad range of pad finishes, including Bare Cu, Cu-OSP, NiAu, ENEPIG and ImSn. Offers a work life of 12 hours or more. After reflow, residues are removed using deionized water. Compatible with printing, transfer and dipping applications.

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