Dymax Releases 9773 Ruggedized Adhesive
Dymax has introduced 9773, a ruggedizing and staking adhesive engineered to secure and protect components on printed circuit boards used in satellites, missiles and other space-based systems. The material is certified to NASA ASTM E595 Low Outgassing and Mil-Std 883 Method 5011 Low Ionic Content standards. Offers on-demand UV/visible light curing, which speeds processing and increases throughput by eliminating delays associated with traditional two-part epoxies. It is non-slumping for up to 72 hours on vertical surfaces and is compatible with jet dispensing, making it well-suited for ruggedizing, staking, or encapsulating PCB components. With a one-part, solvent-free and halogen-free formulation, Dymax 9773 also supports sustainability goals while delivering high performance.
Dymax
