Mek's ISO-Spector X1 3D THT Bottom-Up AOI combines 3D optics and projection technology with inspection algorithms to measure through-hole solder-joint volume and pin height. Supports bottom-up verification for wave and selective-solder processes, with data capture for volume, height and pin extension. System target SMT and THT inspection in electronics manufacturing and process verification.

Mek

https://www.marantz-electronics.com