EP54TC is a two-component, electrically insulating epoxy designed for heat sink bonding and thermal management applications requiring high thermal conductivity. Delivers thermal conductivity exceeding 6W/(m·K). Formulated with a 5–30µm specialty filler to support thin bond lines and efficient void filling, achieving thermal resistance of 5–7×10⁻⁶K·m²/W. Exhibits a tensile modulus above 1,000,000psi at room temperature and is serviceable from –73°C to +204°C. Features a recommended cure schedule of 2 hours at 80°C with a 2–4 hour post cure at 90–125°C, a mixed viscosity of 100,000–200,000cps, and a working life of 60–90 minutes. Available in ounce through gallon kit sizes for prototyping and production use.

Master Bond

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