Alpha OM-377 no-clean solder paste is designed for ultra-fine feature printing in advanced electronics assemblies. The formulation supports component sizes down to 008004 and provides consistent transfer efficiency across fine-pitch designs. It is engineered to improve first-pass yield by reducing head-in-pillow and non-wet open defects while delivering electrochemical reliability for long-term performance. The halogen-free solder paste offers reliable wetting on brass and nickel surfaces and produces low post-reflow residue suitable for dense assemblies. Designed for high-volume manufacturing, Alpha OM-377 supports stable printing and reflow performance in high-density, low-standoff applications used in consumer, wearable and miniaturized electronics.

MacDermid Alpha Electronics Solutions

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