SHANGHAI – Business Media China has issued a call for papers for the China SMT Forum scheduled for Nov. 4-6 at the Shanghai International Exhibition Center.

Abstracts are requested for sessions on lead-free soldering and RoHS-conform technologies, semiconductor packaging and power electronics, PCB technologies, surface finishes and quality control, reliability and testing, assembling and soldering technologies, and electronic markets and future trends.

The deadline for abstracts is April 15.

For more information, visit www.chinasmtforum.com.