BANNOCKBURN, IL – A joint IPC/ECA/Jedec effort to define and classify passive components’ potential of thermal damage during assembly is gaining steam.
 
J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes, is being circulated to the respective trade groups’ memberships for comment and approval. 

According to IPC, J-STD-075 is intended as a “gap filler” to test and classify components prone to thermal damage during assembly.
 
The proposed standard is based on J-STD-020, “Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices,” and IPC-9503, “Moisture Sensitivity Classification for Non-IC Components.” Unlike the former documents, which focus on issues related to moisture absorption, J-STD-075 does not incorporate moisture sensitivity testing or classification for passives or other parts. However, says IPC director of certification and assembly technology Jack Crawford, “It has undergone significant change to thermal classification requirements since the version circulated last fall.”
 
“This document has broad support from component suppliers and it is likely that users will see classification and labeling on component packaging based on this standard,” he added.
 
The document, comment list and comment form can be downloaded at