STAMFORD, CT -- Worldwide semiconductor capital equipment spending will drop 19.8% to $47.5 billion this year, says Gartner Inc.
In December, the research firm forecast a 10% drop for the year.
Global packaging and assembly equipment spending is now forecast to drop 18.1%, extending last year's 3.7% decline. Automated test equipment is expected to drop 13% this year, following last year's 14% decline. Gartner said market conditions for those segments should begin to turn up this summer.