ENDICOTT, NY – The U.S. Department of Defense has awarded Endicott Interconnect Technologies a $148.6 million contract modification to its current program to supply finished assemblies for a high-reliability, high-performance computing application. 
 
Under the deal, EI produces card frame assemblies, including HyperBGA organic semiconductor packaging, multichip module assemblies, PCBs, functionally tested assemblies, and supplies engineering services.