PHILADELPHIA – The American Competitiveness Institute will sponsor a free electronics adhesives workshop on July 11, in Philadelphia.
 
The guest speaker is Brian Toleno, Ph.D., director of technical service for Henkel Electronic Materials, who will discuss differences between physical properties of flip-chip and board-level underfill, and how these properties affect underfilled device reliability. In addition, he will discuss different classes, such as cornerbond or edgebond materials and encapsulants, and their effects on reliability.
 
To register, visit http://www.aciusa.org/workshop or email registrar@aciusa.org by July 9.