SAN JOSE – The US Patent and Trademark Office issued an office action confirming the rejections of all claims of a Tessera Technologies Inc. patent in ex parte reexamination. The patent office previously rejected these claims in an earlier action.
 
The patent relates to semiconductor packaging technologies used in a variety of applications.

The provider of miniaturization technologies is asserting the ‘326 patent in two investigations pending in the U.S. International Trade Commission against a number of companies. The first of those actions was completed July 18. The second action is scheduled for a 7-day hearing to begin on February 5.