SAN JOSE – The MicroElectronics Packaging and Test Engineering Council has finalized the program for its first-quarter symposium, Semiconductor Packaging – Impacting the Age of Consumer Electronics.
 
The event will be held Feb. 19 in San Jose. 
 
Ronald Steger, partner-in-charge of global semiconductor practice, KPMG, will keynote the symposium, discussing the consumer electronics boom – how semiconductor and consumer electronics companies can improve cost, time-to-market and product quality.
 
Other presentation topics include time-to-market and consumer semiconductor packaging; signal integrity: getting it right the first time; modeling package thermal behavior in advanced process technologies; time-to-market is everything; cost-of-ownership challenges for consumer products; a fabless semiconductor's point of view: IC package technology development and the total cost of ownership; an OSAT provider's point of view for consumer applications: IC package development and total cost of ownership challenges; solutions for consumer product miniaturization; STATSChipPAC – evolution of package on package; selecting the right packaging technology: finding the optimum balance between device and system level considerations in consumer applications; trends in low profile packaging; advancing technologies for consumer electronics; new tornado: adoption of MEMS processes by IC industry; microbatteries for integrated autonomous microdevices; the future of MEMS chem-bio sensors, and mobile projection displays based on biaxial scanning MEMS mirrors.