LAS VEGAS -- CIRCUITS ASSEMBLY and Global SMT & Packaging will cohost a free series of technical presentations on electronics manufacturing during Apex at their combined booths.

The range of presentations will cover a number of process-related issues. Panel discussions will also be held, with topics ranging from cleaning, printing and pick-and-place to solder and test.

Tuesday, March 31

Time	Presentation	Presenter/Moderator
11:00-12:00	Cleaning panel discussion Panelists: Mike Konrad (Aqueous Technologies), Steve Stach (Austin American), Mike Bixenman (Kyzen) and Dr. Harald Wack (Zestron).	Trevor Galbraith, Global SMT
12:00-12:30	MagnaPrint - The advantages of a universal squeegee system	Charlie Moncavage, Ovation
12:30-1:00	LUNCH BREAK
1:00-1:30	Printing challenges with today's miniature components	Mike Scimeca, FCT Assembly
1:30-2:00	Innovative PCB cleaning fluids for cleaning leading-edge technologies	Mike Bixenman, Kyzen
2:00-2:30	Reballing and prebumping BGAs, CSPs and QFNs	Jan Martin, Manncorp
2:30-3:30	Process reliability in selective soldering	Christian Ott, SEHO USA
3:00-3:30	Embedded device technology	Mark McMeen, STI Electronics
3:30-4:00	Reducing reflow costs in a challenging economy	Fred Dimock, BTU

Wednesday, April 1

Time	Presentation	Presenter/Moderator
11:00-12:00	Printing panel discussion Panelists: Rita Mohanty (Speedline), Mike Scimeca (FCT) and Tim Jensen (Indium)	Mike Buetow, CIRCUITS ASSEMBLY
12:00-12:30	Stencil cleaning for improved print yields	Bill Schreiber, Smart Sonic Corp.
12:30-1:00	Thermal quality management program	Grant Peterson, ECD
1:00-1:30	LUNCH BREAK
1:30-2:00	New innovations for profiling PCBs	Brian O'Leary, KIC
2:00-2:30	White residue, electrical leakage and metal crystals - the rush to clean 'no clean'	Mike Konrad, Aqueous Technologies
2:30-3:30	Pick and place panel discussion Panelists: Bob Waters (Juki), Derek Gaston (Europlacer) and Leo Van De Val (Assembléon)	Trevor Galbraith, Global SMT
3:30-4:00	Is automated selective soldering right for you?	Eddie Groves, Pillarhouse Int'l
4:00-5:00	Soldering & profiling panel discussion Panelists: Keith Sweatman (Nihon Superior), Fred Dimock (BTU) and Michael Limberg (KIC)	Mike Buetow, CIRCUITS ASSEMBLY

Thursday, April 2

Time	Presentation	Presenter/Moderator
11:00-12:00	Test and inspection panel discussion Panelists: Steve Case (Cyberoptics), Brian D'Amico (MIRTEC), Chris Cain (Agilent) and Ron Lindell (VJ Electronix)	Trevor Galbraith, Global SMT
12:00-12:30	Head in Pillow - BGA defects	Mike Burgess, AIM Solder