BANNOCKBURN, IL – IPC announced winners of the first IPC Academic Poster Competition at Apex.

Top honors went to California Polytechnic State University for “The Calculation of Liquidus Temperature for Various BGA/CSP Assemblies,” authored by Jianbiao (John) Pan.
 
John Folkerts and Frank Collins from Johns Hopkins University took second with “Printed Wiring Board Delamination – Some Unique Findings.”
 
Tied for third were Aaron Pedigo, Pylin Sarobol, John Blendell and Carol Handwerker of Purdue University for “Whisker and Hillock Growth Observed on Pure Sn, Sn-Cu, and Sn-Cu-Pb Electroplated Films,” and John P. Koppes, also from Purdue, for “Utilizing the Thermodynamic Nanoparticle Size Effects for Low Temperature Pb-Free Solder Applications.”
 
Apex attendees voted on the posters, focusing on innovation and originality.
 
More than 30 abstracts were submitted. Cash prizes were awarded to the first, second and third place winners.