KUALA LUMPUR – Unisem (M) Berhad has entered into a cross-licensing agreement with ASAT Ltd., permitting each to manufacture and market the other company’s leadless packaging technologies.

Packaging technologies included are Unisem’s etched leadless package, taped leadframe package and ASAT’s thin array plastic package and thermal leadless array package.

No financial terms were disclosed.

ASAT provides semiconductor package design, assembly and test services. Unisem provides semiconductor assembly and test services.