BROMONT, QUEBEC – The governments of Quebec and Canada have announced a $178-million grant to the Université de Sherbrooke to establish a microelectronics innovation center.
 
The purpose of the project, supported by $83 million from the Canadian government and $95 million from the Quebec government, is to create a global center of excellence for research and innovation in 200-mm based MEMS and 3-D wafer level packaging, as well as advanced technologies associated with the assembly and packaging of silicon chips.
 
Founding partners include DALSA, IBM Canada and Université de Sherbrooke. The founding partners and various semiconductor equipment suppliers will provide support for ongoing operations.