MINNEAPOLIS – SMTA requests abstracts for the 2010 International Conference on Soldering and Reliability being held this May in Toronto. 

Suggested topics to be covered include SnPb with Pb-free components; reliability; harsh environment; tin whiskers; new alloys; electromigration; thermal dissipation; manufacturing process; package-on-package; advanced packaging; halogen-free laminates; high-density interconnects; thermal interface materials, and underfill.

Submit 200-300 word abstracts to Melissa Serres at melissa@smta.org. Include a title, author name and contact information. Abstracts are due Jan. 29. Authors will be notified of acceptance by February.

Technical papers are required and will be due April 9.

Visit http://smta.org/education/education.cfm#toronto for more information.