BANNOCKBURN, IL – IPC has released E revisions of IPC-DRM-PTH, Through-Hole Solder Joint Evaluation Training & Reference Guide, and IPC-DRM-SMT, Surface Mount Solder Joint Evaluation Training & Reference Guide.

These reference tools illustrate acceptance criteria for the evaluation of through-hole and surface mount solder connections. Every change from the D to E revision has been noted.

IPC-DRM-PTH-E contains color illustrations of component, barrel and solder-side perspectives of a plated through-hole. Each drawing shows the minimum acceptable condition for requirements such as land coverage, vertical fill, wetting of lead, land and barrel and contact angle.

It also provides color microphotographs of the major solder defects and conditions such as nonwetting, corrosion, projections, fractures, lead protrusion and disturbed joints with pictures of SnPb and Pb-free solder joints. 

IPC-DRM-SMT-E contains color illustrations of chip component, gull wing and j-lead solder joints. Each drawing shows the minimum acceptable condition for each type of component misalignment and details all of the specifications for min./max. solder joint size, including fillet heights and lengths.

It also provides color microphotographs of the major solder defects and conditions such as nonwetting, solder bridging and disturbed joints.