BANNOCKBURN, IL — IPC last week presented scores of awards to individuals who made significant contributions to standards and programs development.

• J-STD-001 Technical Training Task Group, which developed the J-STD-001E Training Program: Daniel Foster, Defense Acquisition Inc. and Teresa Rowe, AAI Corp., for leadership, and Robert Cooke, NASA Johnson Space Center, Leticia Vasquez, Raytheon Missile Systems, and Katherine Henderson, Solder School Technology.
• For contributions to the J-STD-001E Training Program and IPC-A-610 Training Program: Robert Fornefeld, Norma Moss and Blen Talbot, L-3 Communications; Vicky Freeman and Nancy Chism, Flextronics; Stephen Fribbins, Fribbins Training Services; Kathy Johnston, Raytheon Missile Systems; Leo Lambert, EPTAC; Mel Parrish and Patricia Scott, STI Electronics; Zenaida Valianu, Celestica;Debbie Wade and Barry Morris, Advanced Rework Technology; Jennifer Day, US Army Aviation & Missile Command; Matt Garrett, Phonon.
• Printed Board Handling and Storage Guidelines: Tom Kemp, Rockwell Collins and Don Dupriest, Lockheed Martin, for  leadership, and Bev Christian, Research in Motion; Michael Gay, Isola; Dave Hillman, Rockwell Collins; Joe Kane, BAE Systems; Robert Lazzara, Circuit Connect; Sam Theabo, Plexus; Ashley Collier and Chris Goodall, Celestica; Harold Kleinfeldt, RadiSys.
• IPC Bare Board Cleanliness Assessment Task Group that developed IPC-5704, Cleanliness Requirements for Unpopulated Printed Boards: Doug Pauls, Rockwell andHank Sanftleben, Delphi Electronics and Safety, for leadership, and Doug Boyd, John Rohlfling and Bob Clawson, Delphi Electronics and Safety; Bev Christian, RIM;John Radman, Trace Laboratories – Denver; Dewey Whittaker, Honeywell; Fritz Byle, Astronautics Corp.; and Glenn Colescott, ICAPE – USA.
• IPC Power Conversion Devices Standard Subcommittee that developed IPC-9592A, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries: Jerry Strunk, Lineage Power and Neil Witkowski, Alcatel-Lucent, for leadership, and Don Gerstle, Murata Power Solutions; Michael Erni, Dell; T. Paul Parker, SolarBridge Technologies; Gary Gong, Cisco; Anders Petersson, Ericsson Power Module; Eric Swenson, IBM; Bill Tian, Google; Rudolph Wegener, Hewlett-Packard.
• IPC-2221/2222 Task Group that developed IPC-2222A, Sectional Design Standard for Rigid Organic Printed Boards: Cliff Maddox, Boeing and Gary Ferrari, FTG Circuits, for their leadership. For their valuable contributions: Lance Auer and Joe Schmidt, Raytheon; Don Dupriest and Mike Green, Lockheed Martin; Tom Kemp, Rockwell; Phil Henault and Mike Luke, Raytheon; Lionel Fullwood, WKK Distribution.IPC Land Pattern Subcommittee that developed IPC-7351B, Generic Requirements for Surface Mount Design and Land Pattern Standard: Karen McConnell, Northrop Grumman and Gary Ferrari, FTG Circuits, for leadership, and Tom Hausherr, Mentor Graphics and Jack Olson, Caterpillar.