SMYRNA, GA – CIRCUITS ASSEMBLY is now accepting entries for its 2011 New Product Introduction Award for electronics assembly equipment, materials and software suppliers.

The 4th annual NPI Award recognizes the leading new products for electronics assembly during the past 12 months. Awards are selected by an independent panel of practicing industry engineers, and are presented by CIRCUITS ASSEMBLY.

The 2010 winners included Production Solutions; Aqueous; Kyzen; Assembléon; Europlacer; Data I/O; Polyonics; FCT Assembly; KIC; R&D Technical Services; DEK; Panasonic Factory Solutions; Microscan; Valor; Cobar Solder Products; Speedline Technologies; Juki; SEHO Systems; EVS International; Acculogic; Koh Young, and Henkel.

How does it work?
Entrants must submit a single registration form for each product and category entered. All entries must include a 250-word (maximum) statement describing the product in terms of its innovation, compatibility, cost-effectiveness, design, speed/throughput improvements, ease of use, and maintainability and reparability; a PDF or Word file of corresponding technical product literature and/or product specifications, and a high-resolution (266 dpi or greater) digital image (.jpg, .tif or .eps).

Email information to cdrysdale@upmediagroup.com.

The entry fee is $500 per product.

To be eligible, entries must have been introduced to market (any region) no earlier than April 1, 2010.

Evaluations will be based on the following:
• Creativity and innovation
• Compatibility with existing technology
• Cost-effectiveness
• Design
• Environmental friendliness
• Expected reliability
• Flexibility
• Expected maintainability/reparability
• Performance
• User-friendliness

Awards Ceremony
The awards ceremony will take place April 12, 2011, during the IPC Apex trade show in Las Vegas.

Categories

Equipment:
Automation tools (conveyors, feeders, etc.); bonders; cleaning equipment; component placement – high-speed; component placement – multi-function; device programming; dispensing equipment; labeling equipment; process control tools; rework and repair tools; screen/stencil printing; soldering – reflow; soldering – wave; soldering – selective; soldering – other (vapor phase, hot bar, laser, etc.); soldering – hand tools; software – process control; software – production; software – management (ERP, MRP, etc.); test and inspection – AOI; test and inspection – AXI; test and inspection – ICT

Materials:
Adhesives; cleaning materials; coatings/encapsulants; underfills; flux, and soldering materials (paste, bar, wire, core, etc.)

For more information, visit http://circuitsassembly.com/cms/npi-award.

For 2011 terms and conditions, visit http://www.circuitsassembly.com/cms/magazine/206/5891.

To register, visit https://www.regonline.com/2011_npi_award_presented_by_circuits_assembly.

The deadline for entries is Feb. 10, 2011.