SMYRNA, GA – UP Media Group today announced a series of webinars on such hot topics as package-on-package and high-speed design will take place during the fourth annual VIRTUAL PCB, the industry’s only virtual conference and trade show for the PCB design, fabrication and assembly markets. The two-day worldwide event takes place March 8-9, 2011.

The series of webinars feature industry experts on a range of important printed circuit board design and assembly topics. Dr. Eric Bogatin will speak on signal integrity and high-speed design, for instance, and Bob Willis will discuss package-on-package. Other webinars include bare board and assembly defect appraisal, reflow profiling, and new standards.

Webinars range in length and are available live or on-demand to VIRTUAL PCB registrants.

A fully interactive, Web-based event, VIRTUAL PCB (www.virtual-pcb.com) incorporates all the critical features of a live event, while allowing PCB design, fabrication and assembly equipment and materials buyers and sellers to interact online. VIRTUAL PCB is supported by a proven software platform (provided by INEXPO), and will be accessible on-demand for two months beyond the two-day live event.

Features of the upcoming virtual event will include custom exhibit booths, live attendee-attendee and attendee-exhibitor communication, live and on-demand equipment demonstrations, real-time technical presentations, open “chats” moderated by industry experts, and much more.

For more information about VIRTUAL PCB, visit www.virtual-pcb.com or contact Alyson Skarbek, show manager, at 404-665-7749 or askarbek@upmediagroup.com.