BANNOCKBURN, IL – IPC has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.

The standard provides three standardized test methodologies that enable product developers to determine the best material for their application.

IPC-9708 provides test methods to evaluate the susceptibility of printed board assembly materials and designs to cohesive dielectric failure underneath surface mount technology attach pads. The test methods, including cold ball pull, ball shear and hard pin pull, can be used to rank order and compare different printed board materials and design parameters.

The standard can be used in the process of building test coupons and running tests on these coupons.

IPC says companies using IPC-9708 will see substantial cost reductions by reducing the burden of verification and qualification.

For more information, visit www.ipc.org/9708.