SUNNYVALE, CA — Rambus will team with the Industrial Technology Research Institute in Taiwan on the development of interconnect and 3D packaging technologies, the companies announced today.

In addition, Rambus has joined the Advanced Stacked-System Technology and Application Consortium (Ad-STAC), a multinational research association led by ITRI, a leading research institute. Rambus and ITRI will work together as members of Ad-STAC on the development of system integration using silicon interposer technology. The collaboration combines ITRI’s strength in manufacturing and advanced process technologies as well as the strong system, package and signaling design experience of Rambus.

Initially, the two companies will work together on the development of system integration using silicon interposer technology.

“Collaborating with leading research institutions, such as ITRI, is an effective way for us to advance 3D packaging technology for the broader manufacturing community,” said John Kent, vice president of Technology Development at Rambus. “Combining Rambus experience in high-performance system design and ITRI package research experience can enable new breakthroughs in 3D IC system integration and design.”

“This collaboration brings together Rambus’ advanced high-bandwidth and low-power device designs and ITRI’s know-how in fabrication with our 12" equipment,” said Dr. Ian Chan, VP and general director of the Electronics and Optoelectronics Research Laboratories at ITRI.  “We expect to achieve some compelling and useful results through our joint efforts.”