NEWBURYPORT, MA – Rochester Electronics and BAE Systems have partnered to add more than 250,000 solutions for end-of-life semiconductors used in military and aerospace applications.

Developed from Rochester's wafer and die bank inventory, the recreated semiconductor devices are manufactured with the authorization of the original semiconductor manufacturer, and are guaranteed to be form, fit and functional replacements that match the original semiconductor's performance.

BAE provides the Advanced Component Obsolescence Management product and obsolescence management services.

The partners have produced a “decoder ring” that translates Rochester wafer and die products to finished goods manufacturing part numbers. Rochester wafer and die storage lab stores more than 10 billion die.

No financial terms were disclosed.