BANNOCKBURN, IL – The latest moisture-sensitive device standard now covers handling, packing and shipping of non-IC electronic components.

J-STD-033C, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components, provides guidance for certain electronic components that to date had not been covered. Those include parts classified per J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

The C revision also contains a correction made to the desiccant calculation and an allowance for less use of desiccant for MSL2 parts, if desired. J-STD-033C also includes diagrams of recommended, not recommended and acceptable MBB air evacuation.

The new standard was developed by IPC and JEDEC. It provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow-sensitive SMDs. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation.