TEMPE, AZ – Finetech plans to donate a die bonder in a drawing this summer open to qualified US and Canadian universities and colleges.

The multi-application Pico MA bonder with 5 µm placement accuracy is valued at $100,000. The platform is for advanced packaging and assembly applications, such as flip chip, optoelectronics, 3-D, wafer-level integration, micro-optics assembly, sensor packaging, and precise die bonding.

Finetech celebrates its 20th anniversary this year.