AUSTIN, TX -- Embedded components—actives and passives—embedded in IC package substrates are generating renewed interest, a new report asserts.

Consulting firm TechSearch International’s recent Advanced Packaging Update provides an insight into the new developments at a variety of companies and the driving forces for these embedded devices.

The primary advantage of embedding active devices in a package substrate is reduced package height, but thermal advantages have also been reported. Several companies, including FlipChip International/Fujikura, Fujitsu Microelectronics, Shinko Electric and STATS ChipPAC report that their embedded substrates can be used to assemble package-on-package (PoP) with a total package height of 1.0mm or less (including solder balls), and that there is significant interest from mobile manufacturers. Embedding the die also improves robustness in mechanical shock (drop test), and increases security by making the device more tamper-proof.

Embedded passives, primarily capacitors, have different drivers, and are used to improve decoupling and enable higher operating frequencies on the processor. There are two initial markets for this technology: the high-end networking and communication devices, and the low-power mobile application processors. It appears that mobile processors will be the first to use embedded capacitors in production.

TechSearch’s annual survey on substrate design rules providing special coverage of substrate design rules from suppliers of organic flip chip substrates, PBGAs, and laminate CSPs (FBGAs) worldwide is highlighted. The design rules include body size, core thickness, via and pad diameter, minimum bump pitch supported, and substrate finish. An economic outlook for the industry is provided with an update on the flood recovery in Thailand.

The report is 79 pages and includes a set of PowerPoint slides.

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