BANNOCKBURN, IL – Between 2011 and 2014, high-density interconnect board production is expected to grow 26% for companies that participated in IPC’s recent PCB Technology Trends study.

Companies anticipate greater use of stacked and staggered microvias, leading to any-layer microvias and “via anywhere” capability. While miniaturization and the demands of high-speed technology are driving these trends, companies cite solder mask registration and assembly as the two most common factors limiting the miniaturization of circuitry dimensions, says IPC.

Most of the companies are evaluating new surface finishes, especially electroless nickel, immersion palladium and immersion gold. The high price of gold is having an impact on changes in PCB processing, with nearly one-quarter of the participants trying alternative metals. Seventeen percent of respondents are trying to use reduced thicknesses of gold, including some who claim that the price of gold is having no impact on their material selection, says the association.

Of the two primary substrate materials used today, multi-function epoxy resin is expected to grow to be used in more than half of panel area produced by 2014, while the use of glass fabric is expected to decline. Companies’ data on laminates used, along with forecasts for 2014, show laminates moving toward higher temperature thermal properties. They also predict the use of more low-loss materials. It is expected that by 2014 nearly half of the panel area produced will be halogen-free, and nearly three-quarters will be Pb-free.

The industry anticipates significant increases in the production of hybrids or modules, and in the use of printed electronics and optical technology in producing printed boards by 2014.

Forty-one PCB manufacturing companies participated in the study, including companies in Asia, Europe and North America. They represent 16.5% of the world PCB market.

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白细胞介素 - 班诺克本，2011年至2014年间，高密度互连板生产预计将增长26％，为公司参加IPC最近的PCB技术发展趋势的研究。

公司预期更大的堆积和交错的微孔，龙头“任何层的微孔和通过的任何地方”的能力。而小型化和高速技术的需求正在推动这些趋势，公司举阻焊登记和装配作为最常见的两个因素限制了电路尺寸的小型化，说的IPC。

大部分的公司正在评估新的表面处理，尤其是化学镀镍，浸钯浸金。高的黄金价格是在PCB加工的变化产生影响，有近四分之一的参与者，试图替代金属。 17％的受访者都试图用减少厚度的黄金，包括有些人声称，黄金价格没有影响他们的选材上说，该协会。

今天使用的两个主要基材材料，多功能环氧树脂预计增长将超过2014年生产的面板面积的一半，而玻璃纤维布的使用预计将下降。随着2014年的预测，用于层压板公司的数据，展示层板走向更高温度的热性能。他们还预测更低损耗材料的使用。预计面板生产面积近一半，到2014年将是无卤素，近四分之三将无铅。

业内人士预计在混合动力或模块生产的显着增加，并在使用印刷电子和光学技术，印制电路板生产，到2014年。

四十一PCB制造公司参与了这项研究，其中包括在亚洲，欧洲和北美的公司。他们所代表的世界PCB市场的16.5％。