SAN JOSE -- Ultratech has acquired the rights to a collection of patents from IBM covering fundamental patents in packaging such as C4 bumping, ball grid arrays, lead-free solders and 3D packaging.

Representing both US and foreign patents, the portfolio includes claims directed at methods of making, at compositions and at structures of semiconductor devices. This acquisition strengthens and broadens Ultratech's offerings to facilitate advanced packaging at the lower device nodes.

"Ultratech has periodically purchased patents that it views are key to our business," said Ultratech chairman and CEO Arthur W. Zafiropoulo. "The acquisition of these patents from IBM is the continuation of that strategy to ensure that our customers receive the highest technology content in their products."