SMYRNA, GA – CIRCUITS ASSEMBLY is accepting entries for its 2013 New Product Introduction Awards (NPI) for printed circuit board assembly.

The NPI Awards recognize the leading new products for PCB assembly introduced this calendar year. Awards are selected and presented by CIRCUITS ASSEMBLY.

Awards will be presented in the following categories: Equipment: automation tools (conveyors, feeders, etc.); bonders; cleaning equipment; component placement - high-speed; component placement - multi-function; component storage; device programming; dispensing equipment; labeling equipment; process control tools; rework and repair tools; screen/stencil printing; screen/stencil printing peripherals/consumables; soldering - reflow (convection); soldering – wave; soldering – selective; soldering - other (vapor phase, hot bar, laser, etc.); soldering - hand tools; software - process control; software – production; software – management (ERP, MRP, etc.); test and inspection – AOI; test and inspection – AXI; test and inspection – ICT; test and inspection - functional test; Materials: adhesives; cleaning materials; coatings/encapsulants; underfills; flux; soldering materials (paste, bar, wire, core, etc.); cored wire.

The deadline for entries is Dec. 19, 2012. To be eligible, entries must have been introduced to market (any region) no earlier than Feb. 1, 2012.
 
Entries will be judged on creativity and innovation, compatibility with existing technology, cost-effectiveness, reliability, performance and user-friendliness.
 
Awards will be presented during a ceremony on Feb. 19, 2013, during the IPC Apex Expo in San Diego.
 
For more information, visit http://www.circuitsassembly.com/cms/npi-award, or contact senior editor Chelsey Drysdale at cdrysdale@upmediagroup.com.

To register, visit http://a3.acteva.com/orderbooking/bookEvent/A321277.