SANTA CLARA, CA — Industry experts will gather at a pair of conferences in November to address the mounting challenges with semiconductor multi-die integration, and known good die requirements and benefits that 2.5/3D ICs offer.

The “Roadmaps for Multi Die Integration – Strategies and Drivers”  event will be held Nov. 14, at the Biltmore Hotel in Santa Clara, followed by “Known Good Die:  Reducing Costs through Yield Optimization,” set for Nov. 15 in the same location.

For information on the Roadmaps conference go to https://meptec.org/meptec2012roadma.html, and for the Known Good Die conference, visit https://meptec.org/meptec2012knowng.html.