NEVADA CITY, CA – More designs will include stacked packages in coming years, according to the latest research.

Stacked packages will experience a 13.7% compound annual growth rate from 2011 through 2016, says New Venture Research, while system-in-package (SiP) will have a unit growth rate of 13% CAGR through 2012.

Fan-in QFN and fan-in QFP types of electronics components will see unit growth of 38.6% compounded annually between 2011 and 2016, and fan-in WLPs will experience an 11.6% CAGR through 2016, says the firm.

Flip-chip unit growth will reach 12.6% CAGR through 2016.