BANNOCKBURN, IL – A new standard from IPC on assessing and improving solder paste printing processes is now available in Danish.

IPC-7527, Krav til Tinpastatryk (or Requirements for Solder Paste Printing), was released in English in August and is said to be the first standard to focus on the application of solder paste.

IPC-7527 is the first standard to provide requirements for what the printed solder paste should look like and how far off centers can be before they’re considered defects. It covers basic squeegees to jet dispensers and needle dispensers to closed print heads. In addition, it provides information on automated paste inspection using either cameras or lasers. Covering initial placement on the board through production and testing, the 15-page reference guide features more than 50 photos.

The standard was developed by Task Group Nordic, IPC’s volunteer standards development group in Scandinavia.