BANNOCKBURN, IL – The recently released 2013 IPC International Technology Roadmap for Electronic Interconnections marks a shift throughout the electronics industry: more cooperation and information sharing, the association says.

Published biennially in CD format, the nearly 600-page guide to interconnect technology trends was developed with input from subject matter experts globally.

The 2013 roadmap incorporates data and comparisons to help users serve clients and/or guide their companies in identifying, selecting and developing technology alternatives to create the products needed for future markets.

One of the changes is an expanded section on printed electronics, focusing on more realistic opportunities and challenges of the technology.

Another change within the 2013 roadmap can be found in the environmental section, renamed the “stewardship” section. In addition, the roadmap includes technical presentations made by industry experts within a resource section that provides predictions and descriptions.

The roadmap has an updated section addressing the changes in business models and expectations between OEMs, ODMs, EMS providers and fabricators, and the rise of contractor specialists for previously internal functions.