BANNOCKBURN, IL -- New guidelines from IPC explain the effects of printed circuit board fabrication processing on board cleanliness.

IPC-5703, Cleanliness Guidelines for Printed Board Fabricators, addresses how various PCB fab processes may impact, directly or indirectly, the final cleanliness of bare printed circuit boards.

The 30-page document is a follow-up and companion to IPC-5702, Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards.