SAN JOSE, CA – Fan-In QFNs and QFPs grew 184.5% in 2012; this year, they will rise 15.4%, says New Venture Research.

In 2014, fan-In QFNs and QFPs are expected to grow another 25.9%; in 2015, 11.9%; in 2016, 10.5%, and in 2017, 9.9%.

Demand for array IC packages in general is increasing, as additional I/O connections are fit under the package compared to traditional leadframe packages, says NVR. 
Fan-in QFNs represented 12.4% of total IC packages in 2012, and will represent 12.7% in 2013. By 2014, fan-in QFNs will account for 13.2% of IC packages, and in 2015, 13.8%.  Fan-in QFNs will represent 14.4% of IC packages in 2016 and 14.8% in 2017.

Like fan-in QFNs, demand for both the wafer-level package and fan-out WLP are on the rise.

WLPs accounted for 5.3% of the IC packaging market in 2012, and will account for 5.5% this year. In 2014, WLPs will represent 5.7% of the market; in 2015, 5.9%; in 2016, 6%, and in 2017, 6.1%.

Fan-out WLPs grew 60.1% last year, and will rise another 19% this year. In 2014, they are expected to grow 17%; in 2015, 16.6%; in 2016, 6.8%, and in 2017, 6.1%.