BANNOCKBURN, IL – IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards last week at SMTAI.

For their leadership of the D-12 Flexible Circuits Specifications Subcommittee that developed IPC-6013C, Qualification and Performance Specification for Flexible Printed Boards, Nick Koop, TTM Technologies and Mahendra Gandhi, Northrop Grumman Aerospace Systems, were honored with a Committee Leadership Award.

For their contributions to IPC-6013C, Lance Auer, Raytheon Missile Systems; Scott Bowles, L-3 Fuzing and Ordnance Systems; Steven Bowles, Viasystems Group; Denise Chevalier, Amphenol Printed Circuits; Sidney Cox, DuPont; Mark Finstad, Flexible Circuit Technologies; Tom Gardeski, Gemini Sciences; Cliff Maddox, Boeing Company; Chris Mahanna, Robisan Laboratory; Steven Nolan, Lockheed Martin Mission Systems and Training, and Robert Sheldon, Pioneer Circuits, earned a Distinguished Committee Service Award.

For their leadership of the 3-12d Woven Glass Reinforcement Task Group that developed IPC-4412B, Specification for Finished Fabric Woven from “E” Glass for Printed Boards, Mike Bryant, BGF Industries, and Douglas Eng, PPG Industries, received a Committee Leadership Award.

For their contributions to IPC-4412B, Tab Bates, JPS Composite Materials Corp.; Silvio Bertling, Circuit Foil Trading; Curtis Carter, Saint-Gobain Vetrotex America; Terry Fischer, Hitachi Chemical Co. America; Scott Hinaga, Cisco Systems; Scott Northrup, AGY; Antonio Senese, Panasonic Electric Works; Douglas Sober, Shengyi Technology Co.; Shinya Takahashi, Nittobo, and Dan Welch, Arlon Materials for Electronics, earned a Distinguished Committee Service Award.

For their leadership of the 5-24c Solder Alloy Task Group that developed IPC J-STD-006C, Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications, a Committee Leadership Award went to Jennie Hwang, PhD, ScD, H-Technologies Group and David Adams, Rockwell Collins.

For exceptional contributions to IPC JSTD-006C, Trevor Bowers, Adtran and Mitchell Holtzer, Alpha, earned a Special Recognition Award. Gerald Leslie Bogert, Bechtel Plant Machinery; Derek Daily, Senju Comtek; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Rigo Garcia, NASA Goddard Space Flight Center; Renee Michalkiewicz, Trace Laboratories – Baltimore; Celine Puechagut, Inventec Performance Chemicals; Jeannette Plante, NASA Goddard Space Flight Center; Brook Sandy-Smith, Indium Corp. of America; Bob Teegarden, Honeywell International – Torrance; Karen Tellefsen, Alpha, and Linda Woody, Lockheed Martin Missile and Fire Control, earned a Distinguished Committee Service Award for their contributions to IPC J-STD-006C.

For his leadership of the 3-11 Laminate/Prepreg Materials Subcommittee Ad Hoc Working Group that developed TM 2.4.52, Fracture Toughness of Resin Systems for Base Materials, Karl Sauter, Oracle America, was honored with a Committee Leadership Award. For exceptional contributions to TM 2.4.52, Bob Neves, Microtek (Changzhou) Laboratories; Douglas Sober, Shengyi Technology Co., and Roger Tietze, Huntsman Advanced Technology Center, earned a Special Recognition Award. For their contributions to TM 2.4.52, Lameck Banda, PhD, Dow Chemical USA; Robert Hearn, Dow Chemical USA; Douglas Leyes, Nelco Products, and Michael Young, Specialty Coating Systems, earned a Distinguished Committee Service Award.

For their leadership of the 5-23a Printed Circuit Board Solderability Specifications Task Group that developed IPC J-STD-003C, Solderability Tests for Printed Boards, Gerard O’Brien, Solderability Testing and Solutions and Michah Pledger, Pledger Consulting, received a Committee Leadership Award.

A Special Recognition Award was given to Wendi Boger, Viasystems Group; Trevor Bowers, Adtran; Beverley Christian, PhD, BlackBerry; David Corbett, Defense Supply Center Columbus; C. Don Dupriest, Lockheed Martin Missile and Fire Control; Brian Madsen, PhD, Continental Automotive Systems; Christopher Ryder, AT&S Austria Technologie and Systemtechnik; Russell Shepherd, Microtek Laboratories Anaheim, and Linda Woody, Lockheed Martin Missile and Fire Control, for their exceptional contributions to IPC J-STD-003C.

Joseph Barber, Raytheon Missile Systems; Martin Bayes, PhD, Four Square Consulting; Srinivas Chada, PhD, Schlumberger Well Services; Calette Chamness, US Army Aviation and Missile Command; Gerald Gagnon, Extech Instruments; Reza Ghaffarian, PhD, Jet Propulsion Laboratory; Mahendra Gandhi, Northrop Grumman Aerospace Systems; Louis Hart, PhD, Compunetics; David Hillman, Rockwell Collins; Christopher Hunt, PhD, National Physical Laboratory; Vijay Kumar, Lockheed Martin Missile and Fire Control; Todd MacFadden, Bose Corp.; Chris Mahanna, Robisan Laboratory; George Milad, Uyemura International; James Monarchio, TTM Technologies; Graham Naisbitt, Gen3 Systems; Debora Obitz, Trace Laboratories – Baltimore; Michael Paddack, Boeing Company; Jagadeesh Radhakrishnan, Intel; Henry Rekers, Schneider Electric; Jose Rios, Endicott Interconnect Technologies; Karl Sauter, Oracle America; Douglas Schueller, AbelConn; David Sommervold, The Bergquist Company, Prescott; Vicka White, Honeywell Air Transport Systems; Dewey Whittaker, Honeywell Air Transport Systems, and Tony Yim, Kalex Multi-Layer Circuit Board (Zhongshan) Ltd., earned a Distinguished Committee Service Award for their contributions to IPC J-STD-003C.

For their efforts in redefining FR-4 into two subcategories within UL 746E, Antonio Senese, Panasonic Electric Works and Douglas Sober, Shengyi Technology Co., earned a Special Recognition Award.

For their leadership of the 7-31j Requirements for Structural Enclosure Task Group that developed IPC-A-630, Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures, E. Eddie Hofer, Rockwell Collins and Richard Rumas, Honeywell Canada, received a Committee Leadership Award. For their contributions to IPC-A-630, Bruce Badger, GE Medical Systems; Joseph E. Kane, BAE Systems Platform Solutions; Sean Keating, Amphenol Ltd. (UK); Lisa Maciolek, Raytheon Company; Gregg Owens, Space Exploration Technologies, and Douglas Schueller, AbelConn, earned a Distinguished Committee Service Award.

For their leadership of the 5-33c Conformal Coating Handbook Task Group that developed IPC-HDBK-830A, Guidelines for Design, Selection, and Application of Conformal Coatings, Jason Keeping, Celestica; Amy Hagnauer, Raytheon Company; and Fonda Wu, Raytheon Company, were honored with a Committee Leadership Award.

For their contributions to IPC-HDBK-830A, Greg Alexander, Ascentech; Winn Cannon, Cytec Industries; Stephen Craig, Shin-Etsu Silicones of America; Jonathan Galaska, Dymax Corp.; Nate Grinvalds, Rockwell Collins; Emmanuelle Guene, Inventec Performance Chemicals; Christopher Hunt, PhD, National Physical Laboratory; Joseph Kane, BAE Systems Platform Solutions; Richard Kraszewski, Plexus; Brian Madsen, PhD, Continental Automotive Systems; Randy McNutt, Northrop Grumman; Renee Michalkiewicz, Trace Laboratories – Baltimore; Carlos Montemayor, Dow Corning; Mary Muller, Crane Aerospace and Electronics; Debora Obitz, Trace Laboratories – Baltimore; Mel Parrish, STI Electronics; Douglas Pauls, Rockwell Collins; Arthur Perkowski, Electronic Coating Technologies; Hector Pulido, Nordson Asymtek; Barry Ritchie, Dow Corning; John Rohlfing and Henry Sanftleben, Delphi Electronics and Safety; Jeffrey Sargeant, HumiSeal; Douglas Schueller, AbelConn; James Stockhausen, Elantas PDG; Michael Suwe, Elantas Beck; Jawn Swan, Crystal Mark; Bob Teegarden, Honeywell International – Torrance; Crystal Vanderpan, UL; Bill Vuono, Raytheon Company; John Waryold, HumiSeal; Lee Wilmot, TTM Technologies, and Lamar Young, Specialty Coating Systems, received a Distinguished Committee Service Award.