MINNEAPOLIS – The Best of Conference and winner of the 3D track for the International Wafer-Level Packing Conference was Jessica Fredlund, Silex Microsystems. Coauthors of her paper, “Recent Results Using Met-Via TSV Interposer Technology as TMV Element in Wafer Level Through Mold Via Packaging of CMOS Biosensors,” include Toby Ebefors, Silex Microsystems, and Erik Jung and Tanja Braun, Ph.D., Fraunhofer IZM.

The SMTA selected Best of Conference winners from each of the three tracks: Wafer Level Packaging, 3D (Stacked) Packaging, and MEMS Packaging.

Sumant Sood of SUSS MicroTec won the Best of MEMS Track for his paper "Advanced Metal-Eutectic Bonding for High Volume MEMS WLP." Coauthors include Robert Hergert, SUSS MicroTec and Oliver Treichel, SUSS MicroTec Lithography.

William Boyd Rogers of DECA Technologies won the Best of Wafer-Level Packaging Track for his paper "Implementation of a Fully Molded Fan-Out Packaging Technology." Coauthors include Chris Scanlan and Tim Olson, also from DECA.

The IWLPC technical committee is currently soliciting abstracts for next year’s program. Interested parties should submit 200- to 300-word abstracts at http://www.iwlpc.com/call_for_papers.cfm by Apr. 18. Technical papers are due Aug. 22.

IWLPC will return to the DoubleTree Hotel in San Jose, CA, Nov. 11-13.